Low PIM components for DAS and Macro Cells
Microlab , a Wireless Telecom Group company (NYSE: WTT), has modified its website to make it easier for customers to find Low PIM components and low PIM DCC Series™ DAS Carrier Conditioners. In lieu of complex modulation schemes that are paramount for high speed telecommunication networks, utilization of low PIM components is becoming increasingly important. Carriers need and demand challenging PIM levels for their in-building DAS installations.
“Passive intermodulation (PIM) is an issue at both, Macro cell sites and in-building DAS installations”, says Murat Eron, Vice President of Engineering. “The front end design of the DCC Series™ DAS Carrier Conditioners is critical to low PIM performance of the whole system. RF signals with relatively high power levels have to be duplexed, attenuated and are combined here. PIM at this stage can significantly diminish overall system performance.”